Industry News
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Samsung, Micron two storage factory expansion!
Recently, industry news shows that in order to cope with the increase in demand for memory chips driven by the artificial intelligence (AI) boom, Samsung Electronics and Micron have expanded their memory chip production capacity. Samsung will resume construction of infrastructure for its new Pyeo...Read more -
Vishay introduces new third-generation 1200 V SiC Schottky diodes to improve the energy efficiency and reliability of switching power supply designs
The device adopts MPS structure design, rated current 5 A~ 40 A, low forward voltage drop, low capacitor charge and low reverse leakage current Vishay Intertechnology, Inc. (NYSE: VSH) today announced the launch of 16 new third-generation 1200 V silicon carbide (SiC) Schottky diodes. The Vishay S...Read more -
AI: Product or function?
The latest question is whether AI is a product or a feature, because we’ve seen it as a standalone product. For example, we have the Humane AI Pin in 2024, which is a piece of hardware specifically designed to interact with AI. We have the Rabbit r1, a device that promises to materialize th...Read more -
This article introduces the application of SiC MOS
As an important basic material for the development of the third generation semiconductor industry, silicon carbide MOSFET has a higher switching frequency and use temperature, which can reduce the size of components such as inductors, capacitors, filters and transformers, improve the power conver...Read more -
St’s new wireless charger development board targets industrial, medical and smart home applications
St has launched a Qi wireless charging package with 50W transmitter and receiver to accelerate the development cycle of wireless chargers for high-power applications such as medical instruments, industrial equipment, home appliances and computer peripherals. By adopting ST’s new wireless ch...Read more -
Microchip introduces the TimeProvider® XT extension system to enable the migration to modern synchronization and timing system architectures
TimeProvider 4100 master clock accessories that can be extended to 200 fully redundant T1, E1, or CC synchronous outputs. Critical infrastructure communication networks require high-precision, highly resilient synchronization and timing, but over time these systems age and must migrate to ...Read more -
EMC | EMC and EMI one-stop solution: Solve electromagnetic compatibility problems
In today’s era of ever-changing technology and electronic products, the issue of electromagnetic compatibility (EMC) and electromagnetic interference (EMI) has become increasingly important. In order to ensure the normal operation of electronic equipment and reduce the impact of electromagn...Read more -
Littelfuse introduces IX4352NE low side gate drivers for SiC MOSFETs and high power IGBTs
IXYS, a global leader in power semiconductors, has launched a groundbreaking new driver designed to power silicon carbide (SiC) MOSFETs and high-power insulated gate bipolar transistors (IGBTs) in industrial applications. The innovative IX4352NE driver is designed to provide customized turn-on an...Read more -
On Mei Talks NODAR: Key Technologies and visions for the future of autonomous driving
NODAR and ON Semiconductor have joined forces to achieve a significant breakthrough in the field of autonomous driving technology. Their collaboration has resulted in the development of long-range, ultra-accurate object detection capabilities, enabling vehicles to detect small obstacles on the ro...Read more -
ITEC introduces breakthrough flip chip mounters that are 5 times faster than existing leading products on the market
ITEC has introduced the ADAT3 XF TwinRevolve flip chip mounter, which operates five times faster than existing machines and completes up to 60,000 flip chip mounts per hour. ITEC aims to achieve higher productivity with fewer machines, helping manufacturers reduce plant footprint and operating co...Read more -
TI chip, misused?
Texas Instruments (TI) will face a vote on a shareholder resolution seeking information about possible misuse of its products, including Russia’s incursion into Ukraine. The U.S. Securities and Exchange Commission (SEC) refused to grant TI permission to omit the measure at its upcoming annu...Read more -
AMD CTO talks Chiplet: The era of photoelectric co-sealing is coming
AMD chip company executives said that future AMD processors may be equipped with domain-specific accelerators, and even some accelerators are created by third parties. Senior Vice President Sam Naffziger spoke with AMD Chief Technology Officer Mark Papermaster in a video released Wednesday, empha...Read more
