PCB manufacturing
PCB manufacturing refers to the process of combining conductive traces, insulating substrates, and other components into a printed circuit board with specific circuit functions through a series of complex steps. This process involves multiple stages such as design, material preparation, drilling, copper etching, soldering, and more, aimed at ensuring the stability and reliability of the circuit board's performance to meet the needs of electronic devices. PCB manufacturing is a crucial component of the electronic manufacturing industry and is widely used in various fields such as communications, computers, and consumer electronics.
Product Type
TACONIC printed circuit board
Optical wave communication PCB board
Rogers RT5870 high-frequency board
High TG and high-frequency Rogers 5880 PCB
Multi layer impedance control PCB board
4-layer FR4 PCB
PCB manufacturing equipment
PCB manufacturing capability
PCB manufacturing equipment
PCB manufacturing capability
| thing | Manufacturing capacity |
| Number of PCB layers | 1~64th floor |
| Quality level | Industrial computer type 2|IPC type 3 |
| Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Laminate brands | Kingboard|I TEQ|shegnyi|Nanya|lsola |TUC |S YL|Arlon|Nel co | Taconic |H i ta chi|Rogers et al. |
| high temperature materials | Normal Tg: S1141|KB6160| Huazhen H14 0 (not applicable to lead-free process) |
| Middle Tg: HDI, multi-layer: SY S1000H | ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| High Tg: Thick copper, high-rise ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752| SY S1165 | |
| High frequency circuit board | Rogers| Arlon|Taconic|SY SCGA-500| S7136|Huazheng H500C |
| Number of PCB layers | 1~64th floor |
| Quality level | Industrial computer type 2|IPC type 3 |
| Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Laminate brands | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co | Taconic |H i ta chi|Rogers et al. |
| high temperature materials | Normal Tg: S1141|KB6160| Huazhen H14 0 (not applicable to lead-free process) |
| Middle Tg: HDI, multi-layer: SY S1000H | ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| High Tg: Thick copper, high-rise ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752| SY S1165 | |
| High frequency circuit board | Rogers| Arlon|Taconic|SY SCGA-500| S7136|Huazheng H500C |
| Number of PCB layers | 1~64th floor |
| Quality level | Industrial computer type 2|IPC type 3 |
| Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen free etc. |
| Laminate brands | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co | Taconic |H i ta chi|Rogers et al. |
| high temperature materials | Normal Tg: S1141|KB6160| Huazhen H14 0 (not applicable to lead-free process) |
| Middle Tg: HDI, multi-layer: SY S1000H | ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| High Tg: Thick copper, high-rise ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752| SY S1165 | |
| High frequency circuit board | Rogers| Arlon|Taconic|SY SCGA-500| S7136|Huazheng H500C |
| Plate thickness | 0.1~8.0mm |
| Plate thickness tolerance | ±0.1mm/±10 % |
| Minimum base copper thickness | Outer layer : 1/3oz(12um)~ 1 0oz | inner layer : 1/2oz~6oz |
| Maximum finished copper thickness | 6 ounces |
| Minimum mechanical drilling size | 6mil(0.15mm) |
| Minimum laser drilling size | 3 million (0 . 075mm) |
| Minimum CNC drilling size | 0.15mm |
| Hole wall roughness (maximum) | 1.5 million |
| Minimum trace width/spacing (inner layer) | 2/2mil (Outer l ayer :1 /3oz ,I nner l ayer : 1/2oz) (H/H OZ base copper) |
| Minimum trace width/spacing (outer layer ) | 2.5/2. 5mi l (H/H OZ base copper) |
| Minimum distance between hole and inner conductor | 6000000 |
| Minimum distance from hole to outer conductor | 6000000 |
| Via minimum ring | 3000000 |
| Component hole minimum hole circle | 5000000 |
| Minimum BGA diameter | 800w |
| Minimum BGA spacing | 0.4mm |
| Minimum finished hole ruler | 0.15m m(CNC) | 0. 1mm(laser) |
| half hole diameter | smallest half hole diameter :1mm ,Half Kong is one special craft , Therefore, the half hole diameter should be greater than 1mm. |
| Hole wall copper thickness (thinnest) | ≥0.71 million |
| Hole wall copper thickness (average) | ≥0.8 million |
| Minimum air gap | 0.07 mm (3 million) |
| Beautiful placement machine asphalt | 0. 07 mm (3 million) |
| maximum aspect ratio | 20:01 |
| Minimum solder mask bridge width | 3000000 |
| Solder Mask/Circuit Treatment Methods | film |LDI |
| Minimum thickness of insulation layer | 2 million |
| HDI & special type PCB | HDI (1-3 steps) |R-FPC(2-16 layers)丨High frequency mixed pressure(2- 14th floor)丨Buried Capacitance & Resistance… |
| maximum. PTH (round hole) | 8 mm |
| maximum. PTH (round slotted hole) | 6*10mm |
| PTH deviation | ±3mil |
| PTH deviation (width | ±4mil |
| PTH deviation (length) | ±5mil |
| NPTH deviation | ±2mil |
| NPTH deviation (width) | ±3mil |
| NPTH deviation (length) | ±4mil |
| Hole position deviation | ±3mil |
| Character type | serial number | barcode |QR code |
| Minimum character width (legend) | ≥0.15mm, character width less than 0.15mm will not be recognized. |
| Minimum character height (legend) | ≥0.8mm, character height less than 0.8mm will not be recognized. |
| Character aspect ratio (legend) | 1:5 and 1:5 are the most suitable ratios for production. |
| Distance between trace and contour | ≥0. 3mm (12mil), single board shipped : The distance between the trace and the contour is ≥0 .3mm , shipped as a panel board with V-cut : The distance between the trace and the V-cut line is ≥0 . 4mm |
| No spacing panel | 0mm, Shipped as a panel , The plate spacing is 0mm |
| Spaced panels | 1.6m m, ensure that the distance between boards is ≥ 1 . 6mm, otherwise it will be difficult to process and wire. |
| surface treatment | TSO|HASL|Lead-free HASL(HASLLF)|Immersed silver|Immersed tin|Gold plating丨Immersed gold( EN IG)| ENEP IG|Goldfinger+HASL| ENIG+OSP |ENIG+Gold Finger|OSP+Gold Finger, etc. |
| Solder Mask Finishing | (1) . Wet film (L PI solder mask) |
| (2) .Peelable solder mask | |
| Solder mask color | green | red | White | black blue | yellow | orange color | Purple , grey | Transparency etc. |
| matte :green| blue |Black etc. | |
| Silk screen color | black | White | yellow etc. |
| Electrical testing | Fixture/Flying Probe |
| Other tests | AOI, X-Ray (AU&NI), two-dimensional measurement, hole copper meter, controlled impedance test (Coupon test&Thi rd Party Report) , metallographic microscope, peel strength tester, weldable sex test, logic pollution test try |
| contour | (1).CNC wiring (±0.1 mm) |
| (2).CN CV type cutting (±0 .05mm) | |
| (3) . chamfer | |
| 4) . Mold punching (±0 .1 mm) | |
| special power | Thick copper, thick gold (5U”), gold Finger, buried blind hole , Countersink , half hole , peelable film , carbon ink, countersunk hole , electroplated plate edges, pressure holes, control depth hole , V in PAD IA, non-conductive resin plug hole, electroplated plug hole , Coil PCB, ultra-miniature PCB, peelable mask, controllable impedance PCB, etc. . |
